Substrate segment rounding
Suitable as a replacement or supplementary part for substrate plate clamping system
Order no.
571169
Design:
Substrate segment rounding with integrated fitting holes for precise positioning.
Supplied without pull-stud – for combination with zero-point, slit or undersize 2330 pull-stud sets size 5.
Application:
Substrate segment with round contour for use in metal 3D printing for the 4 corner areas of the 2320-250 substrate plate clamping system.
Suitable as a replacement or supplementary part, e.g. in case of wear or individual segment assembly.
Features:
- Temperature-resistant up to 300 °C
| Order no. | 571169 |
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